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Glass Substrates Are Breaking Through the AI Chip Packaging Bottleneck
Intel's No SeWaRe Result Signals Mass Production One Step Closer. Plus Key Players and Supply Chain Opportunities
May 5 • TrendForce

April 2026

Glass Fiber Cloth: The Underlying Material Shortage in AI Infrastructure
Capacity constraints are not expected to ease until mid-2027, affecting lead times and costs across the AI server supply chain
Apr 30 • TrendForce
All Eyes on CPU: What Industry Leaders Predict
In recent weeks, TSMC, Intel, and Google have signaled that as Agentic AI scales, CPU is reasserting itself at the center of AI infrastructure.
Apr 27 • TrendForce
The Critical Bottleneck in CPO Mass Production? It's Testing
A complete breakdown of CPO testing stages, and the competitive landscape among Advantest, Teradyne, Keysight, and other equipment vendors.
Apr 24 • TrendForce
Meta's $21 Billion Deal Secures Deployment Speed, Not Just GPU Access
The CoreWeave deal underscores that ready-to-deploy compute remains more immediately viable than in-house build-out and in-house silicon in the…
Apr 22 • TrendForce
The Great Rebalance: How Agentic AI Is Reshaping the CPU:GPU Ratio
Agentic AI is driving a structural shift in CPU:GPU ratios — and triggering a supply crunch that has Intel and AMD raising prices.
Apr 14 • TrendForce
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