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From Backup Power to Critical Infrastructure, AIDC Is Rewriting the Energy Storage Playbook
Mapping 15+ Chinese vendors racing to capture AIDC demand.
2 hrs ago
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TrendForce
13
2
Beyond the Chip: How AI's Next Battleground Moves to Rack and POD Scale
Inside NVIDIA, CSPs, and ASIC Designers' Strategies
Jul 3
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TrendForce
18
1
June 2026
Foldable iPhone Is Coming. Is the Crease Problem Finally Solved?
From UTG to OCA, materials science may hold the answer
Jun 26
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TrendForce
13
Complementary, Not Competing: MLCCs and Silicon Capacitors in AI Server Power Integrity
MLCCs Hold the Board. Silicon Capacitors Enter the Package.
Jun 18
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TrendForce
50
5
6
How AI Inference Is Creating New Memory Demand
KV cache offloading and agentic AI as key drivers
Jun 15
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TrendForce
56
6
COMPUTEX 2026: CPO in Focus
Following our previous COMPUTEX 2026 report on memory, this piece turns to another standout theme of the event: Co-Packaged Optics (CPO) technology.
Jun 11
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TrendForce
14
COMPUTEX 2026: Memory in Focus
HBM5, HBF, WoW stacking — here's what memory players brought to the show.
Jun 5
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TrendForce
20
1
May 2026
The Inference Economy Arrives: AI Chip Rules Are Being Rewritten
When Tokens Cost Money, Architecture Becomes Strategy
May 29
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TrendForce
32
1
2
Breaking Through the AI Power Wall: Why SiC/GaN Matter in the HVDC Era
A look at SiC/GaN technology, applications, and the evolving supply chain landscape
May 21
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TrendForce
25
3
Why Warpage Is the Key Challenge for AI Chip Packaging
A Deep Dive into Low-Temperature Curable PSPI, Balance Film, and the Supplier Landscape
May 11
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TrendForce
23
1
2
Glass Substrates Are Breaking Through the AI Chip Packaging Bottleneck
Intel's No SeWaRe Result Signals Mass Production One Step Closer. Plus Key Players and Supply Chain Opportunities
May 5
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TrendForce
67
3
7
April 2026
Glass Fiber Cloth: The Underlying Material Shortage in AI Infrastructure
Capacity constraints are not expected to ease until mid-2027, affecting lead times and costs across the AI server supply chain
Apr 30
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TrendForce
43
4
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