Subscribe
Sign in
Home
Notes
Main Site
Glass Substrates Are Breaking Through the AI Chip Packaging Bottleneck
Intel's No SeWaRe Result Signals Mass Production One Step Closer. Plus Key Players and Supply Chain Opportunities
May 5
•
TrendForce
28
1
April 2026
Glass Fiber Cloth: The Underlying Material Shortage in AI Infrastructure
Capacity constraints are not expected to ease until mid-2027, affecting lead times and costs across the AI server supply chain
Apr 30
•
TrendForce
27
2
All Eyes on CPU: What Industry Leaders Predict
In recent weeks, TSMC, Intel, and Google have signaled that as Agentic AI scales, CPU is reasserting itself at the center of AI infrastructure.
Apr 27
•
TrendForce
10
1
The Critical Bottleneck in CPO Mass Production? It's Testing
A complete breakdown of CPO testing stages, and the competitive landscape among Advantest, Teradyne, Keysight, and other equipment vendors.
Apr 24
•
TrendForce
15
1
1
Meta's $21 Billion Deal Secures Deployment Speed, Not Just GPU Access
The CoreWeave deal underscores that ready-to-deploy compute remains more immediately viable than in-house build-out and in-house silicon in the…
Apr 22
•
TrendForce
10
The Great Rebalance: How Agentic AI Is Reshaping the CPU:GPU Ratio
Agentic AI is driving a structural shift in CPU:GPU ratios — and triggering a supply crunch that has Intel and AMD raising prices.
Apr 14
•
TrendForce
51
1
9
This site requires JavaScript to run correctly. Please
turn on JavaScript
or unblock scripts
