Archive - TrendForce

Advanced Packaging: Market Trends and Outlook

TSMC CoWoS/CoPoS, Intel EMIB, glass substrates and the global supply chain

Aug 18 • TrendForce

China's Aggressive Push for High-End AI Chip Autonomy

Domestic solutions are on track to capture nearly 90% of China's high-end AI chip market in 2026

Aug 10 • TrendForce

Humanoid Robots Part 2: China's Playbook for Building Its Own Robot Supply Chain

From EVs to robots: how China is racing to localize the supply chain, and where challenges remain

Aug 5 • TrendForce

July 2026

Breaking the Memory Bottleneck Part 2: How Tech Giants Shrink the KV Cache Footprint

Deep dive into strategies from Google, NVIDIA, Meta, and DeepSeek

Jul 30 • TrendForce

Breaking the Memory Bottleneck Part 1: How CXL Unlocks the Memory Capacity KV Cache Needs

Deep dive into different approaches from Enfabrica, Penguin Solutions, Marvell, and Meta

Jul 24 • TrendForce

From Training to Inference: A Paradigm Shift in the Memory Hierarchy

A beginner-friendly guide to AI's memory needs today, and where they are headed next

Jul 22 • TrendForce

Humanoid Robots Part 1: The US-China Divide and Who Controls the Supply Chain

With TrendForce's exclusive supply chain index

Jul 17 • TrendForce

From Backup Power to Critical Infrastructure, AIDC Is Rewriting the Energy Storage Playbook

Mapping 15+ Chinese vendors racing to capture AIDC demand.

Jul 10 • TrendForce

Beyond the Chip: How AI's Next Battleground Moves to Rack and POD Scale

Inside NVIDIA, CSPs, and ASIC Designers' Strategies

Jul 3 • TrendForce

June 2026

Foldable iPhone Is Coming. Is the Crease Problem Finally Solved?

From UTG to OCA, materials science may hold the answer.

Jun 26 • TrendForce

Complementary, Not Competing: MLCCs and Silicon Capacitors in AI Server Power Integrity

MLCCs Hold the Board. Silicon Capacitors Enter the Package.

Jun 18 • TrendForce

How AI Inference Is Creating New Memory Demand

KV cache offloading and agentic AI as key drivers

Jun 15 • TrendForce

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