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Breaking Through the AI Power Wall: Why SiC/GaN Matter in the HVDC Era
A look at SiC/GaN technology, applications, and the evolving supply chain landscape
May 21
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TrendForce
14
Why Warpage Is the Key Challenge for AI Chip Packaging
A Deep Dive into Low-Temperature Curable PSPI, Balance Film, and the Supplier Landscape
May 11
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TrendForce
16
1
2
Glass Substrates Are Breaking Through the AI Chip Packaging Bottleneck
Intel's No SeWaRe Result Signals Mass Production One Step Closer. Plus Key Players and Supply Chain Opportunities
May 5
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TrendForce
44
1
3
April 2026
Glass Fiber Cloth: The Underlying Material Shortage in AI Infrastructure
Capacity constraints are not expected to ease until mid-2027, affecting lead times and costs across the AI server supply chain
Apr 30
•
TrendForce
33
3
All Eyes on CPU: What Industry Leaders Predict
In recent weeks, TSMC, Intel, and Google have signaled that as Agentic AI scales, CPU is reasserting itself at the center of AI infrastructure.
Apr 27
•
TrendForce
13
1
The Critical Bottleneck in CPO Mass Production? It's Testing
A complete breakdown of CPO testing stages, and the competitive landscape among Advantest, Teradyne, Keysight, and other equipment vendors.
Apr 24
•
TrendForce
21
1
2
Meta's $21 Billion Deal Secures Deployment Speed, Not Just GPU Access
The CoreWeave deal underscores that ready-to-deploy compute remains more immediately viable than in-house build-out and in-house silicon in the…
Apr 22
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TrendForce
10
The Great Rebalance: How Agentic AI Is Reshaping the CPU:GPU Ratio
Agentic AI is driving a structural shift in CPU:GPU ratios — and triggering a supply crunch that has Intel and AMD raising prices.
Apr 14
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TrendForce
57
1
10
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