COMPUTEX 2026: CPO in Focus
Following our previous COMPUTEX 2026 report on memory, this piece turns to another standout theme of the event: Co-Packaged Optics (CPO) technology. TrendForce outlines the latest CPO initiatives from MediaTek, GUC & Wiwynn, Largan & Ability opto-Electronics Technology (AOET), AuthenX, and LINTES.
MediaTek - CPO IP & LPO AOC
Taiwan’s leading IC design house MediaTek has been aggressively expanding into optical interconnect. After announcing a US$90 million investment in silicon photonics (SiPh) design firm Ayar Labs in February 2026, MediaTek showcased its latest solutions at COMPUTEX 2026 in June. The company demonstrated a CPO technology capable of reaching up to 400 Gbps per fiber to illustrate its scale-up roadmap, alongside a Micro LED LPO AOC sample developed in collaboration with Microsoft Research for scale-out connectivity.
The CPO chip sample on display features an EIC designed in-house by MediaTek, with the PIC co-developed with Ayar Labs. Each fiber delivers up to 400 Gbps, with an 8 x 400 Gbps configuration enabling a 3.2 Tbps optical engine (OE).
Related report: CPO Testing Challenges: TSMC COUPE & Taiwan Supply Chain
MediaTek also integrates Microsoft Research’s MOSAIC Micro LED technology to deliver an Active Optical Cable (AOC) featuring an integrated LPO transceiver. In this design, Micro LED serves as the light source within the LPO transceiver, with each Micro LED operating at 2 Gbps. Approximately 150 Micro LEDs are combined to achieve 200 Gbps aggregate bandwidth (with redundant units included to guard against localized failures).
The Micro LED approach offers a “wide-and-slow” light source with lower power consumption, lower cost, and higher reliability compared with conventional VCSEL and DFB lasers.
Related report: 2026 Infrared Sensing Application Market and Branding Strategies - Micro LED CPO Market Value Analysis
GUC & Wiwynn - CPO Rack
ASIC design service provider GUC has also been actively expanding its optical interconnect capabilities. Following its collaboration announcement with Ayar Labs in November 2025, GUC entered a partnership with Wiwynn and Ayar Labs in May 2026 to jointly develop a rack-scale CPO solution, which was showcased at COMPUTEX.
The CPO rack integrates Ayar Labs’ TeraPHY OEs and ELSFP SuperNova light sources, delivering 800 TB/s of scale-up optical bandwidth across 64 GUC ASICs (32 compute trays) per rack via CPO. It also incorporates a fully liquid-cooled thermal architecture developed in-house by Wiwynn.
Also notable: in addition to GUC and Ayar Labs, Wiwynn disclosed its broader CPO supply chain partners at the show. These include AI chip design services firm Alchip; Detachable FAU suppliers Corning, SENKO, Browave, and FOCI; ELSFP module and connector suppliers Molex, TE Connectivity, and SENKO; and Optical Cable suppliers AFL, Corning, SENKO, Molex, and FOCI. The CPO rack sample on display used SENKO’s ELSFP module, Optical Cable and SN-MT connector.
Largan & AOET - PMLA & FAU
Largan Precision, the global leader in smartphone camera lenses, made its debut at COMPUTEX this year, exhibiting jointly with Ability Opto-Electronics Technology (AOET), of which Largan is the largest shareholder with approximately 15.2% stake. Leveraging its deep expertise in micro-optics design, Largan has developed its own optical coupling technology and unveiled first-ever samples of a multi-channel Photonic Module Lens Assembly (PMLA) and a 2D Fiber Array Unit (FAU).
The PMLA is an integrated optical component combining a prism and collimating lens to redirect the optical path and improve coupling precision. The 2D FAU uses stacked fiber routing to increase fiber density and improve alignment tolerance. The FAU sample demonstrated at the show supports 40 channels across four stacked layers, with 10 channels per layer.
Also worth noting: AOET displayed Metalens technology applicable to IR cameras and sensors, and announced plans to leverage its micro-glass processing capabilities to enter the FAU V-groove foundry segment.
AuthenX - FAU
AuthenX, a subsidiary of EZconn, showcased a Detachable 2D FAU and its application on a CPO chip. AuthenX’s Detachable 2D FAU (40-lens) is distinguished by its proprietary Metalens technology and optical coupling design, combined with a detachable architecture that simplifies maintenance and reduces the time required for repeated optical coupling operations.
LINTES – CPO/CPC Socket
LINTES, a subsidiary of LOTES, demonstrated a universal CPO/CPC socket and provided a live demonstration of CPC applications on-site. The socket is designed by LINTES and tooled for mass production by LOTES.
The CPO/CPC universal socket accommodates 12 Presslink Ultra CPC plugs. Each copper wire on the Presslink Ultra delivers 200 Gbps, with a single plug reaching an aggregate bandwidth of 3.2 Tbps. At this data rate, CPC transmission distance can reliably reach approximately 0.5 meters.
LINTES also displayed an optical engine set sample, an 800G LPO AOC sample, and an 800G OSFP Transceiver sample.